Ua tsaug rau koj mus saib xwm txheej. Tus browser version koj siv tau muaj kev txhawb nqa CSS txwv. Rau qhov kev paub zoo tshaj plaws, peb xav kom koj siv qhov browser hloov tshiab (lossis xiam oob qhab sib haum hom hauv Internet Explorer). Nyob rau hauv lub sijhawm, los xyuas kom meej kev txhawb nqa txuas ntxiv, peb yuav muab lub vev xaib tsis muaj cov qauv thiab JavaScript.
4H-Sic tau ua raws li cov khoom siv rau cov khoom siv hluav taws xob soobonductor. Txawm li cas los xij, kev ntseeg tau ntev ntawm 4H-SIC cov khoom siv yog ib qho kev khuam siab yog ib qho kev pab cuam dav, thiab qhov tseem ceeb tshaj plaws kev ntseeg tau ntawm 4H-SIC cov khoom siv yog bipolar defadation. Qhov kev cuam tshuam no tau tshwm sim los ntawm ib qho kev poob siab ntawm kev ua txhaum (1ssf) tshaj tawm ntawm cov dav hlau lub dav hlau dislocations hauv 4H-sic muaju. Ntawm no, peb hais tawm ib txoj kev rau suppressing 1ssf nthuav ntawm cov protons protonses ntawm 4H-Sic Epitaxial Wafers. Tus Pin Diodes Cricated ntawm Wafers nrog cov yam ntxwv ntawm cov kev ua haujlwm qub tam sim no raws li dodes tsis muaj cov proton implantation. Hauv kev sib piv, tus 1ssf expansion yog siv tau zoo rau hauv cov proton-implanted pin. Yog li, kev cog lus ntawm cov protons mus rau hauv 4H-Sic epitaxial wafers yog ib txoj kev zoo rau kev suppressing bipolar deadiconductor cov khoom siv thaum tuav cov khoom siv ntaus ntawv. Qhov txiaj ntsig no ua rau muaj kev pab txhawb rau kev txhim kho ntawm cov kev ntseeg siab 4H-SIC cov khoom siv.
Cov khoom siv uas silicon (SIC) Muaj ntau lub sic polytypes, ntawm lub 4H-sic tau zoo semiconductor ntaus ntawv lub zog xws li hluav taws xob muaj hluav taws xob thiab muaj zog hluav taws xob hluav taws xob. 4H-Sic Wafers nrog txoj kab uas hla ntawm 6 nti tam sim no ua lag luam thiab siv rau huab hwm hluav taws xob semiconductor Devices3. Traction Systems rau cov tsheb hluav taws xob thiab tsheb ciav hlau tau muab khi siv 4H-SIC4.5 Power Siciconductor cov khoom siv. Txawm li cas los xij, 4H-SIC cov cuab yeej tseem raug kev txom nyem los ntawm kev ntseeg tau ntev yog bipolar defadation2,8,30,11. Qhov kev mob bipolar no tau nrhiav tau ntau tshaj 20 xyoo dhau los thiab tau ntev tau ib qho teeb meem hauv Sicchat ntaub ntaub.
Bipolar defadation yog tshwm sim los ntawm ib qho kev poob siab dua disbagination (1-sic crystals (Redg) Yog li ntawd, yog tias BPD nthuav dav tau raug tsim txom rau 1ssf, 4H-sic fais fab muaj peev xwm ua rau muaj kev tawm tsam bipolar. Ob peb txoj hau kev tau tshaj tawm kom tau tshaj tawm BPD kev hais tawm, xws li BPD mus xov av dislocation (TED) hloov 20,22,23,24. Nyob rau hauv qhov tseeb sic epitaxial wafers, BPD yog nyob rau hauv lub substrate thiab tsis nyob rau hauv lub substrate thiab tsis nyob rau hauv kev hloov dua siab tshiab ntawm kev pib theem ntawm kev loj hlob ntawm ecitaxial kev loj hlob. Yog li ntawd, qhov teeb meem seem ntawm bipolar degradation yog kev faib tawm BPD hauv substrate 25,26,27. Lub ntxig ntawm ib txheej "composite txhawb nqa txheej txheem" ntawm cov txheej txheej ntawm electrate28, 29, 30. Txo tus naj npawb ntawm electron-lub khub txo lub zog tsav tsheb ntawm redg rau bpd rau bpd lub zog txheej yuav muaj kev tawm tsam bipolar. Nws yuav tsum raug sau tseg tias lub ntxig ntawm ib txheej entils cov nqi ntxiv hauv kev tsim cov txheej txheem ntawm cov txheej txheem hluav taws xob, thiab cov khub los ntawm kev tswj hwm tsuas yog tswj ntawm lub tsev nqa khoom lub neej. Yog li ntawd, tseem muaj qhov xav tau muaj lwm txoj kev tsim kho lwm yam kom ua tiav qhov sib npaug zoo ntawm kev tsim kho cov nqi thiab tawm.
Vim tias txuas ntxiv ntawm BPD rau 1ssf yuav tsum tau txav ntawm qee qhov kev tsis sib haum xeeb (PDNING), psning PT yog kev txhawb nqa mus rau hauv kev txwv bipolar. Txawm hais tias pd pinning los ntawm cov hlau impurities tau tshaj tawm, FPDs nyob rau hauv 4H-sic substrates yog nyob ntawm qhov deb tshaj 5 μm los ntawm txheej ecitaxial txheej. Ib qho ntxiv, txij li kev sib txawv ntawm cov hlau tsis muaj kev sib txawv yog qhov me me, nws yog qhov nyuaj rau cov hlau impurities rau diffuse rau hauv substrate34. Vim yog cov khoom loj ntawm cov hlau loj ntawm cov hlau, ion tiv thaiv cov hlau kuj yog qhov nyuaj. Hauv kev sib piv, nyob rau hauv cov ntaub ntawv ntawm hydrogen, lub teeb ci, ions (protons) tuaj yeem cog rau hauv 4H-Sic rau ib tug tob ntawm ntau dua 10 μm siv lub ntsuas tsheb mev. Yog li ntawd, yog tias cov proton implantation cuam tshuam rau pd pinning, tom qab ntawd nws tuaj yeem siv los txhawb bpd kev tshaj tawm hauv substrate. Txawm li cas los xij, cov tshuaj tiv thaiv mob proton tuaj yeem ua kev puas tsuaj 4h-sic thiab ua rau cov khoom siv txo qis rau kev ua haujlwm37,38,39,39,30.
Yuav kom kov yeej cov khoom tsis txaus ntseeg vim muaj kev siv nyiaj txiag ntau, nws yog qhov tseem ceeb ntawm hydrogen oms, nws tau qhia txog hydrogen kev sib txawv ntawm FD tsis txaus los tshawb xyuas qhov pinning ntawm tus nqi siv sims. Yog li ntawd, nyob rau hauv txoj kev tshawb no, peb cog cov protons mus rau hauv 4H-Sic epitaxial wafers ua ntej lub cuab yeej fabrication txheej txheem. Peb siv tus pin dodes uas yog cov cuab yeej sim cuab yeej thiab muab cov khoom siv ua rau muaj cov proton-immanted 4H-Sic Epitaxial Wafers. Peb mam li pom cov yam ntxwv ntawm volt-amerere los kawm qhov kev ua tsis raws kev ua tau zoo vim kev txhaj tshuaj tiv thaiv kev sib txhaj tshuaj. Tom qab, peb pom qhov nthuav dav ntawm 1ssf hauv Electroluminescence (EL) cov duab tom qab thov hluav taws xob rau tus PIN diode. Thaum kawg, peb paub tseeb tias muaj txiaj ntsig ntawm kev txhaj tshuaj tiv thaiv kev sib raug ntawm kev nce nyiaj ntawm 1ssf nthuav.
Ntawm Daim Duab. Daim duab 1 Qhia cov yam ntxwv tam sim no (CVCS) ntawm tus lej PIN ntawm chav sov nrog thiab tsis muaj cov proton implantation ua ntej pulsed tam sim no. Tus Pin Diodes nrog cov qauv kev txhaj tshuaj zoo ib yam li kev txhaj tshuaj uas tsis muaj kev txhaj tshuaj txog kev ua tiav cov IV uas tau sib koom ua ke. Txhawm rau qhia qhov sib txawv ntawm kev txhaj tshuaj ntawm kev txhaj tshuaj, peb tau muab cov phiaj xwm voltage ntawm ib qho kev faib tawm tam sim no los ntawm ib txwm faib tawm los ntawm kab dotted. kab. Raws li tuaj yeem pom los ntawm cov peaks ntawm cov kab nkhaus, lub on-resistance ntawm cov koob tshuaj 1012 thiab 1016 cm-2, thaum lub PIN Peb kuj tau ua cov tshuaj tiv thaiv proton Yog li no, annaling ntawm 1600 ° C tom qab cog ntawm AL one yog cov txheej txheem tsim nyog los ntawm kev ua kom zoo ib yam li cov khoom siv los ntawm kev ua kom zoo ib yam li cov tshuaj tiv thaiv kab mob, uas ua rau muaj kev puas tsuaj rau kev ua kom zoo ib yam li cov tshuaj tiv thaiv kab mob Lub rov qab tam sim no zaus ntawm -5 V kuj tau nthuav tawm hauv daim duab S2, tsis muaj qhov tseem ceeb ntawm dodes nrog thiab tsis muaj kev txhaj tshuaj.
Cov yam ntxwv ntawm volt-ampere ntawm tus pin diodes nrog thiab tsis muaj cov protons nrog ntawm chav tsev kub. Cov lus dab neeg qhia tau cov koob tshuaj tiv thaiv.
Kev ntsuas zaus ntawm ncaj qha tam sim no 2.5 A / CM2 rau tus lej pin dodes nrog txhaj thiab tsis-txhaj cov protons. Cov kab dotted sib raug zoo rau cov kev faib tawm ib txwm.
Ntawm Daim Duab. 3 qhia tau ib daim duab EL ntawm tus PIN diode nrog qhov ceev tam sim no ntawm 25 A / CM2 tom qab voltage. Ua ntej thov cov pulsed tam sim no thauj, thaj chaw tsaus ntawm Diode tsis pom, raws li muaj nyob hauv daim duab 3. C2. Txawm li cas los xij, raws li qhia hauv Daim Duab. 3a, nyob rau hauv ib tug PIN diode yam tsis muaj proton cog cog, ntau txoj kab txaij txaij txaij nrog lub teeb pom kev tau pom tom qab thov hluav taws xob. Xws li cov pas nrig tsaus nti tau pom nyob rau hauv el cov duab rau 1ssf txuas ntxiv los ntawm BPD hauv Substrate28,29. Hloov chaw, qee qhov kev sib tw txuas ntxiv tau pom hauv tus lej Pin diodes nrog cov protons protons, raws li muaj nyob hauv Daim Duab 3B-d. Siv cov xoo hluav taws xob xoo, peb tau lees tias muaj cov ntawv sib tw hauv lub nroog thib ib (duab tsaus ntuj Nyob rau hauv cov nuj nqis 1 thiab 2. Yeeb yaj duab S3-S6 nrog thiab tsis muaj qhov chaw tsaus nti (lub sij hawm-sib dhos tsis muaj kev txhaj tshuaj thiab pom ntawm 1014 cm-2) kuj tau qhia hauv cov ntaub ntawv ntxiv.
Cov duab EL ntawm Pin Diodes ntawm 25 A / CM2 tom qab 2 teev ntawm kev ntxhov siab ntawm (b) 1012 CM-2, (c) 1016 cm-2 protons.
Peb tau suav qhov ceev ntawm kev nthuav dav 1ssf los ntawm kev xam cov dos loj, thiab muaj qhov ntom ntawm kev nthuav dav ntawm 1ssf yog qis dua li hauv qhov tsis-immanted pin.
Cov nqi nce ntxiv ntawm SF tus pin diodes nrog thiab tsis muaj proton implantation tom qab thau khoom nrog ib lub xeev tau muab peb lub sijhawm muaj peb lub ntsuas phoo).
Ua kom luv luv tus neeg nqa khoom lub neej tseem cuam tshuam kev nthuav dav ntxiv, thiab kev txhaj tshuaj tiv thaiv kev txhaj tshuaj txo tus nqa khoom lub neej32,36. Peb tau pom cov khoom nqa lub neej nyob rau hauv ib txheej ecitaxial txheej 60 μm tuab nrog txhaj cov protons ntawm 1014 cm-2. Los ntawm thawj lub tsev nqa khoom lub neej, txawm hais tias qhov tsis pom zoo txo tus nqi rau ~ 10%, tom qab anealing restores nws li ~ 50%, raws li qhia hauv Daim Duab. S7. Yog li ntawd, tus neeg thauj khoom lub neej, txo vim muaj proton implantation, yog rov qab los ntawm kev kub ntxhov siab. Txawm hais tias qhov kev txo qis 50% txo qis lub neej tseem tsim kev tshaj tawm ntawm cov cab tsis muaj zog, uas yog feem ntau sib txawv ntawm kev txhaj tshuaj me me thiab tsis yog-immanted dodees. Yog li ntawd, peb ntseeg tias PD tog Anchoring plays lub luag haujlwm nyob rau hauv kev tiv thaiv 1ssf nthuav.
Txawm hais tias sims tsis pom hydrogen tom qab annaling ntawm 1600 ° C, raws li muaj cov txiaj ntsig ntawm cov lej ntawm 1 thiab 4. 3, 4. 3, 4. Nws yuav tsum raug sau tseg tias peb tsis tau lees tias muaj kev nce ntxiv nyob rau hauv on-lub xeev tiv taus vim mus elongation ntawm 1ssf tom qab nthwv dej tam sim no. Qhov no yuav yog vim yog neeg txhaum cai Ohmic neeg ua tau siv peb cov txheej txheem, uas yuav raug tshem tawm nyob rau yav tom ntej.
Hauv kev xaus, peb tau tsim lub quenching txoj kev rau kev txuas ntawm BPD rau 1HSF hauv 4H-sic pin siv proton cog ua ntej siv Fabrication. Lub deterioration ntawm I-v tus xeeb ceem thaum muaj kev cuam tshuam tsis tseem ceeb, tshwj xeeb yog cov muaj txiaj ntsig ntawm kev ua haujlwm ntawm 1ssf nthuav dav yog qhov tseem ceeb. Txawm hais tias nyob rau hauv txoj kev kawm no peb tau ua kom tuab rau cov kev ua kom pom tseeb rau qhov tob ntawm kev ua kom pom tseeb thiab siv rau lwm yam ntawm 4h-sic li. Cov nqi ntxiv rau cov cuab yeej siv ntaus ntawv thaum lub sij hawm ua kom pom tseeb, tab sis lawv yuav ua zoo ib yam li cov txheej txheem kab ke rau 4H-SIC fais fab fais fab. Yog li, proton cog ua ntej rau kev ua cuab yeej yog ib txoj kev muaj peev xwm rau kev siv cov khoom 4h-sic bipolol fais fab hluav taws xob yam tsis muaj lwm yam.
Ib 4-nti n-hom 4H-sic wafer nrog ib qho txheej txheej me ntawm 10 μm thiab pre-× 1016 cm-3 tau siv ua qauv. Ua ntej ua cov cuab yeej, h + ions tau cog rau hauv lub phaj nrog lub zog nrawm ntawm 0.95 mev ntawm chav tsev kub rau ib lub kaum sab xis kom lub phaj. Thaum lub sij hawm proton cog, lub ntsej muag ntawm ib lub phaj tau siv, thiab lub phaj muaj cov ntu tsis muaj thiab nrog cov tshuaj proton ntawm 1012, 1014, lossis 1016 cm-2. Tom qab ntawd, nyob rau ntawm cov koob tshuaj tiv thaiv ntawm 1020 thiab 1017 cm-° ntawm tag nrho cov wafer rau ib qho tob ntawm 1600 μm thiab 0.2 -0.5 μm thiab 0.2.2 μm thiab 0.2 ° ntawm cov carbon cap los ua cov txheej txheej ap txheej. -type. Tom qab, ib sab sab nraub qaum ni chim tau muab tso rau sab substrate, thaum ib tug 2.0 hli sib tiv thaiv tau muab tso rau ntawm cov txheej txheem ecitaxial sab. Thaum kawg, hu rau annealing yog nqa tawm ntawm qhov kub ntawm 700 ° C. Tom qab txiav cov wafefer rau hauv daim tawv, peb tau ua kev ntxhov siab thiab daim ntawv thov.
Cov yam ntxwv I-V ntawm cov ntaub qhwv ntsej muag ntawm lubricated Pin dodes tau pom siv HP4155B semiconductor parameter analyzer. Raws li kev ntxhov siab hluav taws xob, ib 10-millisecond pulsed tam sim no ntawm 212.5 A / CM2 tau qhia rau 2 teev ntawm ntau zaus ntawm 10 pulses / sec. Thaum peb tau xaiv qhov ceev qis dua tam sim no lossis ntau zaus, peb tsis tau saib 1ssf expansion txawm tias tus pin tsis muaj kev txhaj tshuaj tiv thaiv kev txhaj tshuaj. Thaum lub sij hawm cov cuab yeej siv hluav taws xob voltage, qhov kub ntawm tus pin diode yog nyob ib ncig ntawm 70 ° C tsis muaj cua sov, raws li qhia hauv daim duab S8. Cov duab electroluminescent tau tau ua ntej thiab tom qab kev ntxhov siab hluav taws xob ntawm qhov ceev tam sim no ntawm 25 A / CM2. SynchRotRo Reflector Nab ntsais ntsais koj, λ vector nyob rau hauv bluology, λ = 0.15 nd) ntawm AB8S2 yog -18 lossis 11-28 (Saib cov ntsiab lus). ).
Qhov ntsuas hluav taws xob ntau ntawm ib qho chaw ceev tam sim no ntawm 2.5 A / CM2 yog muab rho tawm nrog ib lub sijhawm ntawm 0.5 v hauv Daim duab. 2 Raws li CVC ntawm txhua lub xeev ntawm tus PIN diode. Los ntawm tus nqi ntawm cov kev ntxhov siab loj thiab cov qauv sib txawv ntawm kev ntxhov siab, peb tau npaj cov kab kev faib khoom hauv daim duab 2 siv cov kab sib luag hauv qab no:
Werner, MR & Fahrner, yuav tsum tshab xyuas cov ntaub ntawv, cov duab, cov tshuab thiab cov khoom siv rau kev siv hluav taws xob siab thiab ua kom haum. Werner, MR & Fahrner, yuav tsum tshab xyuas cov ntaub ntawv, cov duab, cov tshuab thiab cov khoom siv rau kev siv hluav taws xob siab thiab ua kom haum.Werner, Mr. Werner, MR & Fahrner, yuav tsum, wr 对用于高温和恶劣环境应用的材料, 微传感器, 系统和设备的评论. Werner, MR & FAHRER, yuav tsum rov xyuas cov ntaub ntawv, siv cov metures, cov tshuab thiab khoom siv rau cov kev siv kub siab thiab tsis zoo.Werner, Mr thiab Fav, sau cov ntaub ntawv, siv cov ntsiab lus, tshuab thiab khoom siv rau cov ntawv thov kub thiab cov xwm txheej hnyav.Ieee trans. Muaj cov khoom hluav taws xob. 48, 249-257 (2001).
Kimoto, T. & Cooperamentals ntawm Silicon Carbide Technology Cov Cuab Yeej ntawm Silicon Carmide Technology: Kev Loj Hlob, Tshaj Tawm, Cov Khoom Siv thiab Cov Ntawv Vol. Kimoto, T. & Cooperamentals ntawm Silicon Carbide Technology Cov Cuab Yeej ntawm Silicon Carmide Technology: Kev Loj Hlob, Tshaj Tawm, Cov Khoom Siv thiab Cov Ntawv Vol.Kimoto, T. thiab Cooper, JA Basics ntawm Silicon Carbide Technology: Kev Loj Hlob, Cov Khoom Siv, Cov Khoom Siv thiab Cov Ntawv Siv Vol. Kimoto, T. & Cooper, JA 碳化硅技术基础碳化硅技术基础: 增长, 表征, 设备和应用卷. Kimoto, T. & Cooper, JA CARBON 化 Cov thev naus laus zis tshuab cua sov Co. Kev Loj Hlob, Khoom Siv thiab Cov Ntawv Ntim.Kimoto, T. thiab Cooper, J. Bascide Technology Cov Ntsiab Lus ntawm Silicon Carride Technology: Kev Loj Hlob, Khoom Siv thiab Cov Ntawv Siv thiab cov ntawv thov vol.252 (Wiley Singapore Pte Ltd, 2014).
Veliadis, V. nplai loj lag luam ntawm SIC: Cov xwm txheej Quo thiab cov teeb meem kom kov yeej. Amas mater. kev tshawb fawb. Rooj sab laj 1062, 125-130 (2022).
Broughton, J., SMET, V., Tummala, Yk Tshuaj Xyuas Kev Siv Hluav Taws Xob Hluav Taws Xob rau lub zog hluav taws xob rau kev pab pawg. Broughton, J., SMET, V., Tummala, Yk Tshuaj Xyuas Kev Siv Hluav Taws Xob Hluav Taws Xob rau lub zog hluav taws xob rau kev pab pawg.Broughton, J., SMET, V., Tummala, yk Txheej Txheem ntawm Thermal Electronics rau cov phiaj xwm tsheb. Broughton, J., smet, v., Tummala, RR & Joshi, Yk 用于牵引目的的汽车电力电子热封装技术的回顾. Broughton, J., SMET, V., Tummala, RR & Joshi, YkBroughton, J., smet, v., Tummala, yk Txheej Txheem ntawm Kev Siv Tsheb Hluav Taws Xob rau cov khoom siv hluav taws xob tsheb kho hluav taws xob.J. Electron. Pob. trance. ASME 140, 1-11 (2018).
Sato, K., Kato, H. & Fukushima, T. kev loj hlob ntawm S cov lus qhia rau lwm tus rau cov tsheb ciav hlau tom ntej no. Sato, K., Kato, H. & Fukushima, T. kev loj hlob ntawm S cov lus qhia rau lwm tus rau cov tsheb ciav hlau tom ntej no.Sato K., Kato H. thiab Fukushima T. kev loj hlob ntawm ib qho kev thov sic tractation rau tom ntej no cov tsheb ciav hlau siab ceev.Sato K., Kato H. thiab Fukushima T. Traction System Kev loj hlob rau SIC daim ntawv thov rau lwm lub tsheb ciav hlau siab ceev. Daim Ntawv Ntxiv Mewj J. Ind. 9, 453-459 (2020).
Cenzaki, J., Hayashi, S., Yonezawa, Y. & Okumura, H. Cov teeb meem hluav taws xob zoo heev: los ntawm cov xwm txheej tam sim no thiab teeb meem ntawm Sic Wafers. Cenzaki, J., Hayashi, S., Yonezawa, Y. & Okumura, H. Cov teeb meem hluav taws xob zoo heev: los ntawm cov xwm txheej tam sim no thiab teeb meem ntawm Sic Wafers.Cenzaki, J., Hayashi, S., Yonezawa, Y. Cov teeb meem hauv kev txhim kho lub xeev muaj zog: Pib los ntawm lub xeev tam sim no thiab teeb meem ntawm Wafer Sic. Senzaki, J., Hayashi, S., Yonezawa, Y. & Okumura, H. 实现高可靠性 Sic 功率器件的挑战: 从 Sic 晶圆的现状和问题来看. Senzaki, J., Honezawa, Yonezawa, Y. Kev sib tw, H. Qhov kev sib tw ntawm kev ua tiav cov khoom siv hluav taws xob SIC: los ntawm SIC 晶圆的电视和问题设计.Senzaki J, Heyashi s, Yonezawa Y. thiab Okumura H. Cov kev sib tw hauv kev txhim kho fais fab ua raws li cov xwm txheej zoo nkauj raws li cov xwm txheej thiab cov teeb meem cuam tshuam nrog Silicon Carbide Wafers.Thaum xyoo 2018 IEEE International Symposium rau kev ntseeg tau Physics (IRPs). (Cenzaki, J. li al. Eds.) 3B.3-1-3b.3-6 (Ieee, 2018).
Kim, D. & SOUNG, W. Txhim kho cov kev sib tw luv luv -2kV 4H-Sic Mosfet siv cov P-zoo siv los ntawm kev txwv tsis pub ua los ntawm kev txwv. Kim, D. & SOUNG, W. Txhim kho cov kev sib tw luv luv -2kV 4H-Sic Mosfet siv cov P-zoo siv los ntawm kev txwv tsis pub ua los ntawm kev txwv.Kim, D. thiab Sung, V. txhim kho cov kev tiv thaiv luv luv rau ib qho 1.2 kV 4Fet mos txwv siv cov p-zoo siv los ntawm channel kev cog hniav. Kim, D. & Sung, W. 使用通过沟道注入实现的深 P 阱提高了 P 阱提高了 P 阱提高了 1.2kv 4H-Sic Mosfet 的短路耐用性. Kim, D. & Sung, W. P 阱提高了 1.2kv 4H-Sic MosfetKim, D. thiab Sung, V. txhim kho luv luv-1 KV 4H-Sic Mosfets siv cov txiaj ntsig sib sib zog los ntawm kev cog lus.IEEE Electronic Devices Wett. 42, 1822-1825 (2021).
Skowronsi M. li al. Recombination-enhanced suab ntawm kev tsis xws luag nyob rau hauv pem hauv ntej-biased 4h-sic pn dodinges. J. DAIM NTAWV THOV. Physics. 92, 4699-4704 (2002).
Ha, S., Mieszkowski, P., Skowronski, M. & Rowland, LB rho tawm hloov dua siab tshiab hauv 4H Silicon Caritaxy. Ha, S., Mieszkowski, P., Skowronski, M. & Rowland, LB rho tawm hloov dua siab tshiab hauv 4H Silicon Caritaxy.Ha S., Meszkowski P., Skowronski M. thiab Rowland LB rho tawm kev hloov pauv thaum lub sijhawm ua kom muaj 4h silicon carmide ecitaxy. Ha, S., Mieszkowski, P., Skowronski, M. & Rowland, lb 4h 碳化硅外延中的位错转换. HA, S., Mieszkowski, P., Skowronski, M. & Rowland, lb 4h HA, S., Meszkowski, P., Skowronski, M. & Rowland, lbDislocation Transcition 4H hauv Silicon Carbide ecitaxy.J. Crystal. Kev loj hlob 244, 257-266 (2002).
Skowronsi, M. & his, S. Kev ntxhov siab ntawm hexagonal silicon-bas raws bipolol li. Skowronsi, M. & his, S. Kev ntxhov siab ntawm hexagonal silicon-bas raws bipolol li.Skowronsi M. thiab Ha S. Kev tshwm sim ntawm Hexagonal Bipolar cov cuab yeej raws silicon carbide. Skowrons, M. & HA, S. 六方碳化硅基双极器件的降解. Skowronsi M. & HA S.Skowronsi M. thiab Ha S. Kev tshwm sim ntawm Hexagonal Bipolar cov cuab yeej raws silicon carbide.J. DAIM NTAWV THOV. Physics 99, 011101 (2006).
Agarwal, A., Fatima, H., Haney, S. & RYU, S.-h. Agarwal, A., Fatima, H., Haney, S. & RYU, S.-h.Agarwal A., Fatima H., Heini S. thiab Ryu S.-h. Agarwal, A., Fatima, H., Haney, S. & RYU, S.-h. Agarwal, A., Fatima, H., Haney, S. & RYU, S.-h.Agarwal A., Fatima H., Heini S. thiab Ryu S.-h.Ib qho kev ua haujlwm tshiab tsis zoo rau high-voltage sic fais fab neeg muaj hwj chim. IEEE Electronic Devices Wett. 28, 587-589 (2007).
Caldwell, Jd, Stahlebush, Re, Ancona, Mg, Glembocki, OJ & Hobart, KR ntawm Kev Tsav Tsheb Rau Kev Txhaum Cai Ua Phem Rau Hauv 4H-Sic. Caldwell, Jd, Stahlebush, Re, Ancona, Mg, Glembocki, OJ & Hobart, KR ntawm Kev Tsav Tsheb Rau Kev Txhaum Cai Ua Phem Rau Hauv 4H-Sic.Caldwell, JD, Stalbush, Re, Gycona, Mg, Glemboki, OJ, thiab Hobart, KR ntawm kev ua kom zoo-ua rau muaj kev ua yuam kev hauv 4H-Sic. Caldwell, JD, Stahlbush, Re, Ancona, Mg, Glembocki, OJ & Hobart, Kd 关于 4H-Sic 中复合引起的层错运动的驱动力. Caldwell, JD, Stahlbush, Re, Ancona, Mg, Glembocki, OJ & Hobart, KDCaldwell, JD, STALBEL, RE, GLEMBBOKI, OJ, thiab hobart, ntawm Hobart, ntawm Hobart, ntawm Hobart Stacking Txhaum Cai hauv 4H-Sic.J. DAIM NTAWV THOV. Physics. 108, 044503 (2010).
ISJIMA, A. & Kimoto, T. Electronic lub zog rau ib qho shock ShockeLle Stacking Txhaum Cai hauv 4H-Sic muaju. ISJIMA, A. & Kimoto, T. Electronic lub zog rau ib qho shock ShockeLle Stacking Txhaum Cai hauv 4H-Sic muaju.Ijima, A. thiab Kimoto, T. Electronic-zog qauv ntawm kev tsim ntawm ib qho tsis xws luag ntawm shockley ntim hauv 4H-sic muaju. Ijima, A. & Kimoto, T. 4H-Sic 晶体中单 Shockley 堆垛层错形成的电子能量模型. Ijima, A. & Kimoto, T. Electronic lub zog ua qauv ntawm ib lub shock shockeLle stacking Txhaum kev tsim ua hauv 4H-SIC Crystal.Ijima, A. Thiab Kimoto, T. Electron-zog qauv ntawm kev tsim ntawm ib qho tsis xws luag cov ntaub qhwv hauv 4H-sic muaju.J. DAIM NTAWV THOV. Physics 126, 105703 (2019).
ISjima, A. & Kimoto, T. Kev kwv yees ntawm qhov mob tseem ceeb rau kev nthuav dav / cog lus ntawm ib qho kev poob siab ntawm 4H-sic pin dodes. ISjima, A. & Kimoto, T. Kev kwv yees ntawm qhov mob tseem ceeb rau kev nthuav dav / cog lus ntawm ib qho kev poob siab ntawm 4H-sic pin dodes.ITJIMA, A. THIAB KIMOTO, T. Kev kwv yees ntawm lub xeev tseem ceeb rau kev nthuav dav / compression ntawm ib qho tsis xws luag nyob rau hauv 4H-sic pin-diodes. Ijima, A. & Kimoto, T. 估计 4H-Sic Pin 二极管中单个 Shockley 堆垛层错膨胀 / 收缩的临界条件. Ijima, A. Kev kwv yees, T. Kev kwv yees ntawm ib pawg shortley steming txheej nthuav tawm / unfaction cov kev mob hauv 4H-sic pin.ITJIMA, A. THIAB KIMOTO, T. Kev kwv yees ntawm cov kev nthuav dav tseem ceeb rau kev nthuav dav / compression ntawm ib qho tsis muaj zog hauv 4H-sic pin-diodes.Daim ntawv thov physics Wright. 116, 092105 (2020).
Mannen, Y., Simada, K., Asada, K. & Outtani, N. QUANATUM ZOO TSHAJ PLAWS RAU IB TUG DISHSTAL NYOB RAU HAUV TSIS-EQUILIBRALION INIDE. Mannen, Y., Simada, K., Asada, K. & Outtani, N. QUANATUM ZOO TSHAJ PLAWS RAU IB TUG DISHSTAL NYOB RAU HAUV TSIS-EQUILIBRALION INIDE.Mannen Y., Shimada K., Asada K., thiab Otani N. Quantum zoo qauv rau ib qho kev poob siab ntawm 4H-sic siv lead ua tsis muaj mob.Mannen Y., Shimada K., Asada K. thiab Otani N. thiab Quantat cov khoom sib xyaw ua ke hauv 4H-sic muaju nyob rau hauv tsis muaj ib qho chaw tsis muaj leej twg. J. DAIM NTAWV THOV. Physics. 125, 085705 (2019).
Galeckas, A., Piroz, Pirouvez, Pirouvez, Pirouvez, Pirouvez, Pirouve-inducation stacking faults: cov pov thawj rau ib qho dav dav hauv hexagonal sic. Galeckas, A., Piroz, Pirouvez, Pirouvez, Pirouvez, Pirouvez, Pirouve-inducation stacking faults: cov pov thawj rau ib qho dav dav hauv hexagonal sic.Galeckas, A., Pierz, Pirouz, Pirouz, Pirouz, P. Kev siv hluav taws xob tsis raug: Cov ntaub ntawv pov thawj rau ib qho kev sib xws hauv Hexagonal Sic. Galeckas, A., Linnros, J. & PIROUZ, Pirouz, P. 复合诱导的堆垛层错: 六方 sic 中一般机制的证据. Galeckas, A., PIRROS, J. & PIRROS, P. Cov pov thawj rau cov cuab yeej dav dav ntawm kev sib tw Stacking Txheej Txheem: 六方 Sic.Galeckas, A., Pierz, Pirouz, Pirouz, Pirouz, P. Kev siv hluav taws xob tsis raug: Cov ntaub ntawv pov thawj rau ib qho kev sib xws hauv Hexagonal Sic.physics txiv postor Wright. 96, 025502 (2006).
Ishikawa, Y., Sudo, Yoo, Y.-Z., Txheej Txheem Shocking ua txhaum nyob rau hauv ib qho kev poob siab ntawm ib pawg neeg poob siab (11 2 00)Ishikawa, Y., M. sudo, y.-z nqaj irradiation.Ishikawa, Y., sudo M., Y.-Z Psychology.Kem, ю., ____. Судо, Y.-Z Chem., J. Chem., 123, 225101 (2018).
Kato, M., Katahira, S., S., Y., T. Shockt of Carreatley Stacking Forts thiab ntawm ib nrab tsis haum hauv 4H-Sic. Kato, M., Katahira, S., S., Y., T. Shockt of Carreatley Stacking Forts thiab ntawm ib nrab tsis haum hauv 4H-Sic.Kato M., Katahira S., I. Harada S. thiab Kimoto T. thiab Kimoto T. thiab Kimoto T. thiab cov pob khoom tsis txaus siab rau hauv 4H-Sic. Kato, M., Katahira, S., Ichikawa, Y., Harada, S. & Kimoto, T. Shock-sic 部分位错中载流子复合的观察. Kato, M., Katahira, S., S., Ichikawa, Y., Herada, S. & Kimoto, T. 4H-sic ib nrab 位错中载流子去生的可以.Kato M., Katahira S., I. Harada S. thiab Kimoto T. thiab Kimoto T. thiab Kimoto T. thiab cov pob khoom tsis txaus siab rau hauv 4H-Sic.J. DAIM NTAWV THOV. Physics 124, 095702 (2018).
Kimoto, T. & Watanabe, H. Cov kws tsim khoom tsim hauv Sic Technology rau high-voltage fais fab khoom siv. Kimoto, T. & Watanabe, H. Cov kws tsim khoom tsim hauv Sic Technology rau high-voltage fais fab khoom siv.Kimoto, T. thiab Watanabe, H. Kev loj hlob tsis xws hauv sic technology rau high-voltage fais fab khoom siv. Kimoto, T. & Watanabe, H. 用于高压功率器件的 Sic 技术中的缺陷工程. Kimoto, T. & Watanabe, H. Cov kws tsim khoom tsim hauv Sic Technology rau high-voltage fais fab khoom siv.Kimoto, T. thiab Watanabe, H. Kev loj hlob tsis xws hauv sic technology rau high-voltage fais fab khoom siv.Daim ntawv thov physics Express 13, 120101 (2020).
Zhang, Z. & Sudarshan, TS Basal plane dislocation-free epitaxy of silicon carbide. Zhang, Z. & Sudarshan, TS Basal plane dislocation-free epitaxy of silicon carbide.Zhang Z. thiab Sudarshan Ts Dislocation-dawb epitaxy ntawm silicon carbide hauv lub dav hlau. Zhang, Z. & Sudarshan, ts 碳化硅基面无位错外延. Zhang, Z. & Sudarshan, TsZhang Z. thiab Sudarshan Ts Dislocation-dawb epitaxy ntawm silicon carbide basal dav hlau.daim ntawv qhia. Physics. Wright. 87, 151913 (2005).
Zhang, Z., Moulton, E. & Sudarshan, Ts Pachanism ntawm kev tshem tawm cov phiaj xwm Basal hauv Sic nyias cov yeeb yaj kiab los ntawm etched substrate. Zhang, Z., Moulton, E. & Sudarshan, Ts Pachanism ntawm kev tshem tawm cov phiaj xwm Basal hauv Sic nyias cov yeeb yaj kiab los ntawm etched substrate.Zhang Z., Moulton Caim mechanism ntawm kev rhuav tshem ntawm lub hauv paus plane dislocations los ntawm etched substrate. Zhang, Z., Moulton, E. & Sudarshan, ts 通过在蚀刻衬底上外延消除 sic 薄膜中基面位错的机制. Zhang, Z., Moulton, E. & Sudarshan, Ts cov txheej txheem ntawm kev tshem tawm ntawm sic nyias zaj duab xis los ntawm etching lub substrate.Zhang Z., Moulton Caim mechanism ntawm kev tshem tawm ntawm lub dav hlau lub dav hlau cuam tshuam hauv sic nyias cov yeeb yaj kiab los ntawm etched substrates.Daim ntawv thov physics Wright. 89, 081910 (2006).
Shtalbush Re li. Kev cuam tshuam loj zuj zus los txo qis hauv lub dav hlau lub dav hlau tsis txaus siab thaum lub sijhawm 4H-Sic Epitaxy. daim ntawv qhia. Physics. Wright. 94, 041916 (2009).
Zhang, X. Hloov pauv ntawm cov dav hlau basal dislocations rau xov kab tsis zoo nyob rau hauv 4H-Sic Epilayers los ntawm kev kub ntxhov. Zhang, X. Hloov pauv ntawm cov dav hlau basal dislocations rau xov kab tsis zoo nyob rau hauv 4H-Sic Epilayers los ntawm kev kub ntxhov.Zhang, X. thiab Tsuchida, H. Kev hloov pauv ntawm cov dav hlau hluav taws xob tsis cuam tshuam rau hauv cov ntawv xov xwm hauv 4H-Sic epitaxial txheej los ntawm kev kub siab ntxiv. Zhang, X. & Tsuchida, H. 通过高温退火将 4h-sic 外延层中的基面位错转化为螺纹刃位错. Zhang, X. & Tsuchida, H. 通过高温退火将 4H-SICZhang, X. thiab Tsuchida, H. Kev hloov ntawm cov pib lub dav hlau tsis cuam tshuam rau hauv Filament Ntug dej hauv 4H-Sic Epificaxial txheej los ntawm kev kub siab rau qhov kub.J. DAIM NTAWV THOV. Physics. 111, 123512 (2012).
Zaj nkauj, H. & Sudarshan, TS B B B B B B B B B B B B B B BASLODION conversion nyob rau hauv kev loj hlob ntawm kev xaiv tau ntawm 4 ° Tawm-Axis 4H-Sic. Zaj nkauj, H. & Sudarshan, TS B B B B B B B B B B B B B B BASLODION conversion nyob rau hauv kev loj hlob ntawm kev xaiv tau ntawm 4 ° Tawm-Axis 4H-Sic.Zaj nkauj, H. thiab Sudarshan, TS Kev hloov pauv ntawm cov txheej txheem Basal dislocations nyob ze ntawm Opitaxial txheej thaum so-axis kev loj hlob ntawm 4h-Sic. Zaj nkauj, H. & Sudarshan, Ts 在 4 ° 离轴 4h-sic 外延生长中外延层 外延生长中外延层 / 衬底界面附近的基底平面位错转换. Zaj nkauj, H. & Sudarshan, Ts 在 4 ° 离轴 4H-Sic Zaj nkauj, H. & Sudarshan, TsPlanar rho nyiaj ntawm kev hloov chaw ntawm lub substrate ze ntawm cov txheej uas yog nyob ze ntawm cov txheej txheem kev loj hlob thaum lub sij hawm thib 4 ° axis.J. Crystal. Kev loj hlob 371, 94-101 (2013) (2013).
KONISHI, K. LI AL. Thaum siab tam sim no, qhov kev tshaj tawm ntawm lub basal dav hlau dislod stacking Txhaum rau hauv 4H-Sic epitaxial txheej hloov mus rau Fileament ntug kev. J. DAIM NTAWV THOV. Physics. 114, 014504 (2013) (2013).
KONISHI, K. LI AL. Tsim cov txheej txheem xaiv rau Bipolar tsis yog cov khoom plig Sicafets uas pom tias qhov chaw ua hauj lwm txuas ntxiv hauv kev ua haujlwm xoo hluav taws xob. AIP Advanced 12, 035310 (2022).
Lin, S. li al. Cawv ntawm lub dav hlau basal dislocation qauv ntawm ib qho kev poob siab ntawm ib qho kev sib tsoo ntawm kev ua txhaum tam sim no ntawm 4H-sic pin dodes. Nyiv. J. DAIM NTAWV THOV. Physics. 57, 04fr07 (2018).
Tahara, T., li al. Cov neeg tsis muaj hnub nyoog luv luv hauv lub neej nyob rau hauv Nitrogen-nplua nuj 4H-Sic Epilayers yog siv los txhawb kev ua txhaum hauv tus pin dodger. J. DAIM NTAWV THOV. Physics. 120, 115101 (2016).
Tahara, T. li al. Txhaj cov cab kuj vam khom kev cia siab ntawm ib qho shockley stacking kev sib txig sib txig nyob rau hauv 4H-sic pin dodes. J. DAIM NTAWV THOV. Physics 123, 025707 (2018).
Mae, S., T., Tsuchida, H. & Kato, M micreen FCA system rau qhov ntsuas qhov chaw nyob hauv Sic. Mae, S., T., Tsuchida, H. & Kato, M micreen FCA system rau qhov ntsuas qhov chaw nyob hauv Sic.Mei, S., Tawara, T., Tsuchida, H. thiab Kato, M. FCA Micros Elecuptime daws teeb meem hauv silicon carbide. Mae, S., T., Tsuchida, H. & Kato, M. 用于 Sic 中深度分辨载流子寿命测量的显微 Fca FCA 系统. Mae, S., T., Tsuchida, H. & Kato, M. Rau Suab nruab nrab hauv nruab nrab FCA.Mei S., Tawara H., Tsuchida H. thiab Kato M. thiab Kato M. thiab Kato-FCA system rau qhov kev ntsuas cov tsheb thauj khoom hauv silicon.Amas Matter Science Rooj Sab Laj 924, 269-272 (2018).
Hirayama, T. li al. Cov kev faib tawm tob hauv Carrier lub neej nyob rau hauv tuab 4H-Sic epitaxial txheej yog ntsuas tsis siv lub sijhawm daws kev nqus thiab hla kev. Hloov mus rau kev tshawb fawb. Meter. 91, 123902 (2020).
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